The **ATS-07D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Heat Sink Type** | Fine-Pitch (Straight Fin) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | ~17.48°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Component Design & Features #### A. The Fin Design The "Fine-Pitch" design provides a high surface area-to-volume ratio. This is critical for electronic enclosures where space is limited but high heat dissipation is required. #### B. Attachment Mechanism (pushPIN™) Instead of using messy thermal adhesives or fragile clips, this part uses a **Push-Pin** system: * **Spring-loaded:** Ensures consistent pressure (clamping force) across the component surface for optimal thermal transfer. * **Pre-drilled holes:** Requires specific PCB hole patterns for secure mounting. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a phase-change or grease-like layer on the bottom surface that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This specific heat sink is categorized as a "low profile" solution (only 10mm high), making it ideal for: * **1U Rack Servers:** Where vertical clearance is extremely tight. * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Electronics:** Cooling MOSFETs or small voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 17.48 | | 300 | 1.5 | 8.89 | | 500 | 2.5 | 6.42 | | 700 | 3.5 | 5.23 |