The **ATS-07D-10-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)* and is designed primarily for the thermal management of integrated circuits (ICs), such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Dimension (Length x Width)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 7.89°C/W (at 1.0 m/s airflow) | | **Fin Type** | XCUT (Cross-Cut) | --- ### 2. Key Design Features * **XCUT Fin Pattern:** Unlike straight fins, the XCUT design features gaps in the fins. This increases turbulence and allows for multidirectional airflow, which is critical in compact electronic enclosures where airflow may not be linear. * **push-PIN™ Mounting:** This model utilizes a pre-drilled hole mounting system with a brass or plastic push-pin and a compression spring. This ensures: 1. **Uniform Pressure:** Constant force is applied to the thermal interface material (TIM). 2. **Stability:** High vibration resistance compared to clip-on or adhesive solutions. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766**, a high-performance thermal grease, to ensure maximum heat transfer from the electronic component to the aluminum base. --- ### 3. Application in Electronics In an electronic circuit, the ATS-07D-10-C2-R0 acts as a passive cooling element. It is typically found in the following environments: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For industrial PCs where active fans might fail. * **Power Supplies:** Dissipating heat from voltage regulators or MOSFETs. --- ### 4. Thermal Performance Data Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Air Velocity (m/s) | LFM | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 0.5 | 100 | 14.50 | | 1.0 | 200 | 7.89 | | 2.0 | 400 | 4.30 | | 3.0 | 600 | 3.30 |