The **ATS-07D-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 25.00mm | | **Thermal Resistance (LFM 200)** | 2.01 °C/W | | **Thermal Resistance (LFM 700)** | 0.89 °C/W | | **Fin Style** | Spread Fin (Tapered) | --- ### ## Key Electronic & Mechanical Features #### 1. Thermal Resistance Performance The primary function of this part is to reduce the junction temperature of a semiconductor. As air velocity increases (measured in Linear Feet per Minute - LFM), the thermal resistance drops significantly. * **Passive Cooling:** In still air, it provides basic dissipation. * **Active Cooling:** At high airflows (700 LFM), it reaches an efficiency of **0.89 °C/W**, meaning for every watt of heat generated, the component temperature rises by less than 1 degree Celsius. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `ATS-07D-06-C3-R0` uses a mechanical **pushPIN™** system. * **Reliability:** Ensures constant pressure between the heat sink and the component, optimizing thermal transfer. * **Installation:** Uses a brass/plastic pin and a compression spring to lock into pre-drilled holes on the PCB. #### 3. maxiFLOW™ Fin Design The "spread fin" geometry is designed to maximize surface area while minimizing pressure drop. This allows air to flow through the fins more easily, preventing "dead zones" where heat can accumulate. #### 4. Material and Coating * **Base Material:** Aluminum allows for lightweight construction and rapid heat conduction. * **Finish (C3):** The blue anodized finish provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. --- ### ## Applications This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Server blades and industrial PCs. * **Power Electronics:** Motor drivers and power conversion modules.