The **ATS-07D-01-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "blue ice" high-performance heat sink series. --- ## Technical Specifications The primary function of this part is thermal management, specifically designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-07D-01-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 40mm x 40mm x 6mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Key Components & Construction ### 1. The Heat Sink Body The body is made of extruded aluminum. The **6mm height** makes it a "low-profile" solution, ideal for slim electronic enclosures or blade servers where vertical space is limited. The blue anodized finish is not just for aesthetics; it provides corrosion resistance and slightly improves emissivity. ### 2. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this part uses a **plastic push-pin** system. * **Reliability:** Provides consistent pressure on the chip, which improves heat transfer. * **Ease of Installation:** Allows for quick assembly on PCBs with pre-drilled holes. ### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Reduces thermal resistance significantly compared to dry mounting. --- ## Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic system: * **@ 200 LFM (Linear Feet per Minute):** Thermal Resistance is approximately **12.50 °C/W**. * **@ 500 LFM:** Thermal Resistance drops to approximately **5.40 °C/W**. ### Installation Example (Pseudocode) While this is a hardware component, its placement is often defined in PCB design software (like Altium or Eagle) via keep-out zones: ```cpp // Thermal Constraint Definition for ATS-07D-01-C3-R0 Component HeatSink_U1 { Manufacturer = "Advanced Thermal Solutions"; Footprint = "HS_40x40_PushPin"; MountingHole_Distance = "43.5mm"; // Standard for 40mm pins Required_Airflow = "200-500 LFM"; } ``` ---