The **ATS-07B-07-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount (Heat Sink) | | **Dimensions** | 45mm x 45mm | | **Height (Off Base)** | 12.00mm | | **Thermal Resistance** | 17.09°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (with compression springs) | --- ### Key Components & Design Features #### 1. Material and Construction * **Aluminum Body:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves radiant heat emissivity. #### 2. The pushPIN™ Attachment System This part uses a specific mechanical attachment method rather than thermal adhesive: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These provide precise, uniform pressure across the thermal interface material (TIM), ensuring maximum contact between the component and the heatsink. #### 3. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**. Lower values indicate better heat transfer. * **At 100 LFM (Linear Feet per Minute):** 17.09°C/W. * **At 700 LFM (High Airflow):** Performance improves significantly to approximately 2.15°C/W. --- ### Common Applications The ATS-07B-07-C3-R0 is typically used in environments where space is limited but cooling is critical: * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded systems and compact motherboards. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. ---