The **ATS-07A-72-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. Specifically, it is a heat sink from the **pushPIN™** series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal performance. | Specification | Detail | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design Features The "C2" and "R0" suffixes in the part number refer to the specific configuration and environmental compliance: * **Push-Pin Attachment:** Instead of using messy thermal adhesives or complex screws, this part uses a spring-loaded push-pin mechanism. This ensures even pressure across the chip surface for optimal heat transfer. * **Straight Fin Geometry:** The vertical fins are designed to allow airflow from a cooling fan or chassis intake to pass through easily, stripping heat away from the aluminum base. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves thermal emissivity. --- ### 3. Key Electronic Applications This heat sink is typically found in the following electronic environments: * **Processors & FPGAs:** Used on high-speed logic chips that generate significant heat in a small footprint. * **Telecommunications:** Cooling components in routers, switches, and base stations. * **Embedded Systems:** Ideal for industrial PCs where space is restricted (due to the low 15mm profile). * **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Comparison of Thermal Performance Thermal resistance (measured in °C/W) indicates how many degrees the component temperature will rise for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.11 | | 300 (1.5 m/s) | 2.33 | | 500 (2.5 m/s) | 1.78 | *Note: As airflow increases, the efficiency of the ATS-07A-72-C2-R0 increases significantly.*