The **ATS-07A-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The part number encodes specific physical and material characteristics: | Feature | Specification | Description | | :--- | :--- | :--- | | **Series** | pushPIN™ HS | High-performance thermal interface | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Attachment** | Push-Pin | Secure mechanical mounting system | | **Thermal Resistance** | 7.51 °C/W (Unducted) | Efficiency of heat dissipation at 100 LFM | | **Dimensions** | 40mm x 40mm | Standard square footprint | | **Height** | 15mm | Low profile for compact enclosures | --- ### 2. Component Design Details #### A. Fin Geometry * **Fin Type:** Straight Fin. * **Pattern:** Designed for optimal airflow throughput. The spacing between fins minimizes pressure drop while maximizing the surface area available for convection. #### B. Mounting Mechanism (Push-Pin) This heat sink utilizes a specialized push-pin system rather than adhesive tape: * **Springs:** Included to provide precise vertical pressure (Pre-assembled). * **Hole Pattern:** Requires specific PCB hole diameters (usually 3.175mm) to lock the pins in place. * **Reliability:** Mechanical attachment is superior to thermal tape in high-vibration environments. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model typically comes with **T412** thermal interface material. * **Function:** Fills microscopic air gaps between the component die and the heat sink base to ensure maximum heat transfer. --- ### 3. Applications The ATS-07A-182-C2-R0 is commonly used in: * **Telecommunications:** Cooling of high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm. * **Power Electronics:** Dissipating heat from MOSFETs or power regulators. ---