The **ATS-07A-159-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** family, designed for efficient thermal management of electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Base Dimensions** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Thermal Resistance** | 10.68 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | COARSE-PITCH | | **Fin Style** | STRAIGHT | --- ### 2. Key Component Features #### A. Attachment Mechanism: pushPIN™ Instead of messy adhesives or simple clips, this model uses a **pushPIN™** system. * **Compression Springs:** Provides precise pressure to ensure optimal thermal interface contact. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes on the PCB. #### B. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes with **pre-applied phase-change material** or high-performance thermal grease. This ensures low thermal resistance between the component surface and the heat sink base without requiring manual application. #### C. Fin Design * **Straight Fins:** Optimized for airflow in a single direction. * **Coarse Pitch:** Allows for better performance in systems with lower air velocity or natural convection, as it is less prone to "clogging" from dust and allows air to pass through with less resistance. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps identify its specific electronic application: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **07** | Series / Attachment Type | | **A** | Aluminum Material | | **159** | Specific dimension/geometry code | | **C1** | Thermal performance/Fin configuration | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Use Cases This heat sink is specifically designed for: * **Telecom/Networking:** Cooling ASICs and FPGAs. * **Embedded Systems:** For low-profile industrial PC builds. * **Power Supplies:** Heat dissipation for voltage regulators and MOSFETs.