ATS-06G-75-C3-R0
AI

The **ATS-06G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
---
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Fin Type** | Fine-Pitch (Vertical fins) |
| **Thermal Resistance** | 1.57 °C/W (at 1.0 m/s airflow) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 30mm |
| **Weight** | ~60 grams |
---
### 2. Design Breakdown
* **pushPIN™ Attachment:** Unlike adhesive tapes, this model uses a spring-loaded pin mechanism. This ensures consistent pressure between the heat sink and the chip, which improves thermal transfer and allows for secure mounting in high-vibration environments.
* **Fine-Pitch Fins:** The "G" series indicates a specific fin density. These thin, closely spaced fins provide a high surface area-to-volume ratio, making them ideal for systems with forced-air cooling (fans).
* **Blue Anodized Coating:** The blue finish is not just aesthetic; it protects the aluminum from corrosion and slightly increases the emissivity of the surface, aiding in heat radiation.
---
### 3. Electronic Application
This part is typically used in the following scenarios:
1. **Industrial Computing:** Cooling processors in embedded systems.
2. **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules.
3. **Telecommunications:** Managing thermals in high-speed networking switches or routers.
---
### 4. Thermal Performance Comparison
Thermal resistance (measured in °C/W) indicates how many degrees the component temperature will rise per watt of power dissipated.
| Airflow Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 0.5 (Low) | 2.50 |
| 1.0 (Medium) | 1.57 |
| 2.0 (High) | 1.10 |
- ⤷
What is the difference between pushPIN and clip-on mounting for heat sinks?
- ⤷ How do I calculate the required thermal resistance for my specific chip?
- ⤷ Does the blue anodized finish affect electrical conductivity?