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  • ATS-06G-75-C3-R0

  • AI
    The **ATS-06G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Type** | Fine-Pitch (Vertical fins) | | **Thermal Resistance** | 1.57 °C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Weight** | ~60 grams | --- ### 2. Design Breakdown * **pushPIN™ Attachment:** Unlike adhesive tapes, this model uses a spring-loaded pin mechanism. This ensures consistent pressure between the heat sink and the chip, which improves thermal transfer and allows for secure mounting in high-vibration environments. * **Fine-Pitch Fins:** The "G" series indicates a specific fin density. These thin, closely spaced fins provide a high surface area-to-volume ratio, making them ideal for systems with forced-air cooling (fans). * **Blue Anodized Coating:** The blue finish is not just aesthetic; it protects the aluminum from corrosion and slightly increases the emissivity of the surface, aiding in heat radiation. --- ### 3. Electronic Application This part is typically used in the following scenarios: 1. **Industrial Computing:** Cooling processors in embedded systems. 2. **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules. 3. **Telecommunications:** Managing thermals in high-speed networking switches or routers. --- ### 4. Thermal Performance Comparison Thermal resistance (measured in °C/W) indicates how many degrees the component temperature will rise per watt of power dissipated. | Airflow Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (Low) | 2.50 | | 1.0 (Medium) | 1.57 | | 2.0 (High) | 1.10 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and clip-on mounting for heat sinks?
    • ⤷ How do I calculate the required thermal resistance for my specific chip?
    • ⤷ Does the blue anodized finish affect electrical conductivity?