The **ATS-06G-72-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Thermal Resistance** | 2.13°C/W (at 200 LFM) | | **Mounting Type** | Push-pin with Springs | | **Pin Style** | Straight Fin (Standard) | --- ### 2. Core Components & Design Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "Straight Fin" design allows for maximum airflow through the fins, making it ideal for systems with high-velocity forced air cooling. #### B. The Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system: - **Material:** Brass or Plastic pins. - **Springs:** Pre-assembled springs provide consistent pressure (compression force) across the component surface, ensuring optimal thermal interface contact. - **Security:** This provides a more robust mechanical connection than tape, essential for environments subject to vibration or shock. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface material. - **T766 Phase Change Material:** This is pre-applied to the base. When the component heats up, the material softens to fill microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06G** | Series (Push-Pin Heat Sink Series) | | **72** | Specific Fin/Size configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant version | --- ### 4. Application Use Cases - **Telecommunications:** Cooling of high-speed networking chips. - **Embedded Systems:** Thermal management for industrial PC processors. - **Power Electronics:** Managing heat in VRMs (Voltage Regulator Modules) and power MOSFETs. ---