The **ATS-06G-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Fin Style** | XCUT (Cross-cut / Pin Fin) | | **Thermal Resistance** | Approx. 10.68°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "C1" designation indicates it uses a **pushPIN™** mechanism. This provides: * **High Pressure:** Ensures a tight interface between the heat sink and the component for better heat transfer. * **Reliability:** Mechanical attachment is more durable than thermal tape under high-vibration conditions. * **Uniformity:** The compression springs provide even pressure across the thermal interface material (TIM). #### B. XCUT Fin Design The "XCUT" geometry refers to a cross-cut pattern. This allows for: * **Omnidirectional Airflow:** It can receive cooling air from any direction, making it ideal for crowded PCBs where airflow direction might be unpredictable. * **Increased Surface Area:** The gaps between pins increase the total area available for convection. #### C. Material and Finish The unit is made of **Aluminum 6063**, which offers a good balance between weight and thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides: * Corrosion resistance. * Increased surface emissivity (improving radiant heat transfer). * Electrical insulation on the surface of the aluminum. --- ### 3. Applications This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processing chips in routers and switches. 2. **Embedded Systems:** For industrial computers where space (height) is limited to 10mm. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 06 G - 159 - C1 - R0 | | | | | | | | | +-- Revision Code | | | +------- Attachment Type (pushPIN) | | +------------- Series/Geometry ID | +-------------------- Fin Style (Cross-cut) +-------------------------- Advanced Thermal Solutions (Brand) ```