The **ATS-06F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family, designed to provide efficient cooling for integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.27°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a "Straight Fin" design, which is optimized for **forced-air cooling** (environments with fans). The vertical fins provide a large surface area for heat to dissipate into the surrounding airflow. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system. * **Spring-Loaded:** Each pin is equipped with a compression spring to provide precise and consistent pressure on the component. * **Reliability:** This prevents the heat sink from shifting during vibration or shipping, making it ideal for industrial or high-vibration environments. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific type of thermal interface material pre-applied to the base. This is usually a high-performance phase-change material or thermal pad that fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying the specific variant: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **06:** Product Series * **F:** Fin pitch/Density * **91:** Specific dimensions and fin configuration * **C3:** Thermal Interface Material (TIM) type * **R0:** Revision code / RoHS Compliance status --- ### 4. Typical Applications * **CPUs/GPUs:** Cooling microprocessors in embedded systems. * **ASICs & FPGAs:** Managing heat in telecommunications and networking hardware. * **Power Supplies:** Heat dissipation for power converters.