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  • ATS-06F-82-C2-R0

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    ## Technical Overview of ATS-06F-82-C2-R0 The **ATS-06F-82-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of heat sinks, designed for efficient cooling of semiconductors and PCB components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 10.79 °C/W (at 100 LFM) | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design and Construction * **Heat Sink Material:** Constructed from high-quality aluminum, which offers a balance between lightweight properties and high thermal conductivity. * **Fin Style:** It utilizes a straight-fin design. This is optimized for **longitudinal airflow**, allowing air to pass through the channels easily to dissipate heat from the base. * **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it provides a protective layer against corrosion and slightly increases surface emissivity for better radiation heat transfer. --- ### 3. Mechanical Attachment: The pushPIN™ System The "06F" in the part number indicates the specific mounting configuration. The pushPIN™ system replaces traditional adhesive tapes or messy thermal epoxies. * **Spring-Loaded:** It uses a brass or plastic pin with a high-tension stainless steel spring. * **Pressure Management:** Ensures even pressure across the thermal interface material (TIM), preventing "hot spots" on the chip. * **Reusability:** Unlike adhesive methods, this can be easily removed and reinstalled for maintenance or upgrades. --- ### 4. Thermal Performance Data The efficiency of this part is measured by how much it resists heat flow (Thermal Resistance). Lower numbers indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.79 | | 200 (1.0 m/s) | 3.95 | | 300 (1.5 m/s) | 2.33 | | 400 (2.0 m/s) | 1.72 | --- ### 5. Part Number Breakdown ```text ATS - 06 - F - 82 - C2 - R0 | | | | | | | | | | | └── Revision Code | | | | └─────── Color/Finish (C2 = Blue Anodized) | | | └──────────── Product Family ID | | └───────────────── Fin Configuration (F = Fine) | └────────────────────── Attachment Type (06 = pushPIN) └──────────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do I calculate the correct hole diameter on the PCB for the pushPIN system?
    • ⤷ In what scenarios is a straight-fin design preferred over a cross-cut fin design?