ATS-06F-82-C2-R0
AI

## Technical Overview of ATS-06F-82-C2-R0
The **ATS-06F-82-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of heat sinks, designed for efficient cooling of semiconductors and PCB components.
---
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 10.79 °C/W (at 100 LFM) |
| **Dimensions** | 30.00mm x 30.00mm x 25.00mm |
| **Fin Pattern** | Straight Fin |
---
### 2. Physical Design and Construction
* **Heat Sink Material:** Constructed from high-quality aluminum, which offers a balance between lightweight properties and high thermal conductivity.
* **Fin Style:** It utilizes a straight-fin design. This is optimized for **longitudinal airflow**, allowing air to pass through the channels easily to dissipate heat from the base.
* **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it provides a protective layer against corrosion and slightly increases surface emissivity for better radiation heat transfer.
---
### 3. Mechanical Attachment: The pushPIN™ System
The "06F" in the part number indicates the specific mounting configuration. The pushPIN™ system replaces traditional adhesive tapes or messy thermal epoxies.
* **Spring-Loaded:** It uses a brass or plastic pin with a high-tension stainless steel spring.
* **Pressure Management:** Ensures even pressure across the thermal interface material (TIM), preventing "hot spots" on the chip.
* **Reusability:** Unlike adhesive methods, this can be easily removed and reinstalled for maintenance or upgrades.
---
### 4. Thermal Performance Data
The efficiency of this part is measured by how much it resists heat flow (Thermal Resistance). Lower numbers indicate better cooling.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.79 |
| 200 (1.0 m/s) | 3.95 |
| 300 (1.5 m/s) | 2.33 |
| 400 (2.0 m/s) | 1.72 |
---
### 5. Part Number Breakdown
```text
ATS - 06 - F - 82 - C2 - R0
| | | | | |
| | | | | └── Revision Code
| | | | └─────── Color/Finish (C2 = Blue Anodized)
| | | └──────────── Product Family ID
| | └───────────────── Fin Configuration (F = Fine)
| └────────────────────── Attachment Type (06 = pushPIN)
└──────────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do I calculate the correct hole diameter on the PCB for the pushPIN system?
- ⤷ In what scenarios is a straight-fin design preferred over a cross-cut fin design?