The **ATS-06F-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.88°C/W (at 100 LFM) to 0.81°C/W (at 700 LFM) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Design Features * **Fin Style (Fine-Pitch):** The "F" in the part number indicates a fine-pitch fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** This system uses a flexible, tool-free mechanism. It consists of a pin and a spring that applies precise pressure to the component, ensuring maximum contact with the heat source. * **Material Selection:** The 6063 aluminum alloy provides an excellent balance between thermal conductivity, weight, and corrosion resistance. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink is highly dependent on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.88 | | 300 (1.5 m/s) | 1.11 | | 500 (2.5 m/s) | 0.90 | | 700 (3.5 m/s) | 0.81 | --- ### 4. Implementation Example If you are designing a PCB with a high-speed processor or FPGA, you would use this part to prevent thermal throttling. ```markdown # Application Steps: 1. Locate the 30x30mm footprint on the PCB. 2. Ensure two 3.0mm mounting holes are drilled at the specified pitch. 3. Align the pre-applied T766 thermal pad over the component. 4. Press the pushPINs until they "click" into the PCB holes. ```