The **ATS-06F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 2.60 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | --- ### 2. Physical Design Elements * **Fin Geometry:** It features a **Straight-Fin** design. This is optimized for systems where there is a consistent, directional airflow. The spacing between fins allows air to pass through and carry heat away from the base. * **Material:** Constructed from high-grade aluminum. Aluminum provides a balance between excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Attachment Mechanism (pushPIN™) This specific part number utilizes the **pushPIN™** system, which consists of: 1. **Spring-loaded Pins:** These ensure even pressure across the surface of the processor or chip to maximize thermal contact. 2. **Flexible Mounting:** It comes with pre-drilled holes to match specific PCB layouts, reducing the risk of the heat sink shifting during vibration or shipping. 3. **Thermal Interface Material (TIM):** This model typically comes with **T412** thermal tape or grease pre-applied to the base to bridge the microscopic air gaps between the component and the heat sink. --- ### 4. Thermal Performance The performance of the ATS-06F-79-C3-R0 is dependent on the airflow (LFM - Linear Feet per Minute): * **Unducted Flow:** 2.63 °C/W @ 100 LFM. * **Ducted Flow:** 1.15 °C/W @ 100 LFM. *Note: Lower °C/W values indicate better cooling efficiency.* ---