The **ATS-06F-67-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-67-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive cooling enhancement) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.30°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | --- ### Key Features and Design #### 1. Material and Coating The unit is constructed from **Aluminum**, which provides a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. #### 2. Fin Geometry The "67" in the series often refers to a specific fin configuration. This model typically features a **Straight Fin** or **Cross-Cut** design. * **Purpose:** To maximize surface area while allowing air to flow through the channels via forced convection (fans) or natural convection. #### 3. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin** system: * **Reliability:** Provides consistent pressure on the component (TIM - Thermal Interface Material). * **Security:** Prevents the heat sink from shifting during high-vibration environments or shipping. * **Compatibility:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### 4. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the product comes with a pre-applied high-performance thermal interface (likely a phase-change material or a thermal pad) to ensure there are no air gaps between the chip and the aluminum base. --- ### Performance Context The thermal resistance of **20.30°C/W** indicates how much the temperature of the chip will rise above the ambient air for every watt of heat dissipated. * **Low Airflow:** Higher resistance (runs hotter). * **High Airflow (LFM):** Lower resistance (runs cooler). --- ### Applications * **BGA Cooling:** Ball Grid Array components that generate moderate heat. * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PCs where mechanical stability is required.