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  • ATS-06F-59-C2-R0

  • AI
    The **ATS-06F-59-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling semiconductor components such as BGAs, FPGAs, and processors. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-59-C2-R0 | | **Heat Sink Type** | Fine-Pitch, Straight Fin | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 7.94°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features ### A. Material and Design * **Aluminum Construction:** Lightweight with high thermal conductivity. The blue anodized finish provides durability and a professional aesthetic. * **Fine Pitch Fins:** The straight-fin design optimizes the surface area for heat dissipation, making it highly effective in forced-air (fan-cooled) environments. ### B. Mounting Mechanism (Push-Pin) * The **"F"** in the part number indicates the specific push-pin hardware. * The assembly uses a brass or plastic push-pin with a stainless steel spring to provide consistent pressure on the electronic chip, ensuring optimal thermal contact. ### C. Thermal Interface Material (TIM) * It comes with **T766** pre-applied. This is a high-performance thermal pad/grease that fills microscopic air gaps between the component and the heat sink base. --- ## 3. Applications This part is typically used in industrial and telecommunications equipment where high-density components generate significant heat: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial computers and controllers. * **Power Supplies:** Cooling voltage regulators or power transistors. --- ## 4. Dimensional Drawing Summary * **Base Length/Width:** 40mm x 40mm (Square profile). * **Height:** 20mm (Low-to-mid profile height, suitable for 1U or 2U chassis). * **Pin Spacing:** Designed for specific PCB hole patterns (standard for 40mm heat sinks).
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods if push-pins cannot be used on my PCB?
    • ⤷ How does the air flow rate (LFM) specifically affect the thermal resistance of this heat sink?
    • ⤷ Is the T766 thermal interface material electrically conductive or insulative?