ATS-06F-59-C2-R0
AI

The **ATS-06F-59-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling semiconductor components such as BGAs, FPGAs, and processors.
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## 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-06F-59-C2-R0 |
| **Heat Sink Type** | Fine-Pitch, Straight Fin |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 20mm |
| **Thermal Resistance** | 7.94°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Features
### A. Material and Design
* **Aluminum Construction:** Lightweight with high thermal conductivity. The blue anodized finish provides durability and a professional aesthetic.
* **Fine Pitch Fins:** The straight-fin design optimizes the surface area for heat dissipation, making it highly effective in forced-air (fan-cooled) environments.
### B. Mounting Mechanism (Push-Pin)
* The **"F"** in the part number indicates the specific push-pin hardware.
* The assembly uses a brass or plastic push-pin with a stainless steel spring to provide consistent pressure on the electronic chip, ensuring optimal thermal contact.
### C. Thermal Interface Material (TIM)
* It comes with **T766** pre-applied. This is a high-performance thermal pad/grease that fills microscopic air gaps between the component and the heat sink base.
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## 3. Applications
This part is typically used in industrial and telecommunications equipment where high-density components generate significant heat:
* **Network Switches/Routers:** Cooling high-speed processing chips.
* **Embedded Systems:** For industrial computers and controllers.
* **Power Supplies:** Cooling voltage regulators or power transistors.
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## 4. Dimensional Drawing Summary
* **Base Length/Width:** 40mm x 40mm (Square profile).
* **Height:** 20mm (Low-to-mid profile height, suitable for 1U or 2U chassis).
* **Pin Spacing:** Designed for specific PCB hole patterns (standard for 40mm heat sinks).
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What are the alternative mounting methods if push-pins cannot be used on my PCB?
- ⤷ How does the air flow rate (LFM) specifically affect the thermal resistance of this heat sink?
- ⤷ Is the T766 thermal interface material electrically conductive or insulative?