The **ATS-06F-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height (Fin)** | 25mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Key Design Features * **Cross-Cut Fin Design:** Unlike straight-fin heat sinks, this model uses a cross-cut pattern. This increases the surface area and allows for better airflow from multiple directions, making it ideal for systems with complex internal air turbulence. * **Push-Pin Mounting:** It uses a standardized push-pin mechanism with a brass tip and a stainless steel spring. This provides a precise and consistent "attachment force" (pressure) on the chip, which is critical for maximizing thermal transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or a similar high-performance phase-change material, ensuring a low-resistance path between the component and the heat sink. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; anodizing increases the surface emissivity, slightly improving radiant heat transfer and protecting the aluminum from corrosion. --- ### 3. Application Use Cases The ATS-06F-52-C3-R0 is commonly used in environments where space is limited but heat generation is high: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators in power supplies. 4. **Networking:** Cooling SFP modules or network interface cards (NICs). --- ### 4. Thermal Performance Comparison *Performance varies based on airflow (LFM - Linear Feet per Minute):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.97 | | 300 (1.5 m/s) | 4.18 | | 500 (2.5 m/s) | 3.03 | | 700 (3.5 m/s) | 2.50 |