The **ATS-06F-38-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-06F-38-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Fin Type** | Straight Fin (Extruded) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 28.45mm | | **Thermal Resistance** | 6.42°C/W (at 100 LFM airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 🔍 Key Electronic Design Elements ### 1. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-based heatsinks, this part uses a **Push-Pin** system. This provides several advantages for PCB design: * **Constant Pressure:** The springs ensure uniform contact pressure between the heatsink and the component, optimizing heat transfer. * **Secure Mounting:** It prevents the heatsink from shifting due to vibration or shock. * **Required Hole Pattern:** The PCB must have specific pre-drilled holes to accommodate the pins. ### 2. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the electronic component's package and the aluminum base, significantly reducing thermal impedance. ### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer protects against corrosion and slightly increases surface emissivity, which aids in radiant cooling. ### 4. Aerodynamic Fin Design The **Straight Fin** geometry is optimized for "open-air" or "ducted" airflow. Because the fins are vertical and parallel, they offer low resistance to air passing through, making them ideal for systems with standard cooling fans. --- ## 📈 Performance vs. Airflow The efficiency of this part depends heavily on the Linear Feet per Minute (LFM) of airflow provided by the system fan: * **@ 200 LFM:** Thermal resistance drops to approximately **3.28°C/W**. * **@ 500 LFM:** Thermal resistance drops further to approximately **1.94°C/W**.