The **ATS-06F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 17.68°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | --- ### 2. Design and Construction The "ATS-06F-33-C3-R0" follows a specific naming convention that identifies its physical characteristics: * **Finned Design:** It features a **Straight Fin** pattern. This is ideal for applications where airflow is directed through the fins in a specific orientation (ducted or high-velocity airflow). * **Material (Aluminum):** Provides a balance between thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or a similar high-performance interface to ensure a low-resistance contact between the component and the heat sink. --- ### 3. Mounting System (pushPIN™) One of the defining "parts" of this assembly is the **pushPIN™** mechanism. 1. **Spring-Loaded:** It uses a brass or plastic pin with a stainless steel spring. 2. **Pressure Consistency:** The spring ensures constant, even pressure across the electronic component, which is critical for efficient heat transfer. 3. **Hole Pattern:** It requires pre-drilled holes in the Printed Circuit Board (PCB). For this 35mm model, the hole spacing is generally **40mm x 40mm**. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 17.68 °C/W | 17.68 °C/W | | 300 | 4.50 °C/W | 6.80 °C/W | | 500 | 3.30 °C/W | 4.80 °C/W | ---