The **ATS-06F-31-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Key Technical Specifications Below is a breakdown of the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | --- ### 2. Component Design & Features #### A. The Fin Profile The "Straight Fin" design is optimized for environments where there is a consistent direction of airflow. The fins provide a large surface area for heat exchange between the aluminum and the surrounding air. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heatsinks, this model uses a **push-pin and compression spring** system: * **Precision:** Ensures the heatsink is centered exactly over the heat source. * **Contact Pressure:** The spring provides consistent downward force, which optimizes the performance of the Thermal Interface Material (TIM). * **Reliability:** It is more resistant to vibration and thermal expansion than simple tape. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes pre-applied with **T766** thermal phase-change material. This eliminates the need for manual application of thermal paste and ensures a thin, high-conductivity bond. --- ### 3. Usage Requirements To use this part in a PCB design, the following hardware requirements must be met: 1. **Hole Pattern:** The PCB must have pre-drilled holes to accommodate the push-pins. The pitch for this specific model is **40.00mm**. 2. **Clearance:** Ensure a 10mm height clearance above the component. 3. **Airflow:** Since the thermal resistance drops significantly with increased airflow (from 25.25°C/W at 100 LFM to 1.58°C/W at 700 LFM), active cooling (fans) is highly recommended. ---