The **ATS-06F-210-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06F-210-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 70mm x 70mm x 6mm | | **Thermal Resistance** | 5.18°C/W (at 200 LFM) | | **Fin Type** | XCUT (Cross-Cut) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics #### XCUT Fin Geometry The "XCUT" design features a cross-cut pattern. This allows air to flow through the fins from multiple directions, making it highly effective in systems where airflow is turbulent or non-linear. #### Material and Coating * **Aluminum:** Provides a balance between lightweight design and high thermal conductivity. * **Blue Anodization:** Not only provides a professional aesthetic but also increases the surface emissivity and protects the aluminum from corrosion. #### Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This ensures maximum heat transfer between the electronic component (heat source) and the heat sink base by filling microscopic air gaps. --- ### 3. Attachment Mechanism This specific model uses a **Push-Pin** system with a brass spring. * **Ease of Installation:** No tools are required; the pins snap into pre-drilled holes on the PCB. * **Consistent Pressure:** The springs ensure that the heat sink maintains constant contact pressure against the chip, which is critical for thermal performance. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Routers, switches, and base stations. * **High-Speed Computing:** Video processing units and FPGA cooling.