The **ATS-06F-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Thermal Resistance** | 10.50°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 6mm (Ultra-low profile) | | **Fin Style** | Straight Fin | --- ### Component Breakdown #### 1. Thermal Performance The "C2" in the part number indicates the thermal performance grade. This heat sink is designed for high airflow environments. While its thermal resistance is 10.50°C/W at low speeds, it drops significantly to approximately **1.88°C/W** under high airflow (700 LFM), making it highly efficient for high-density servers. #### 2. Mechanical Design (pushPIN™) The part utilizes the **pushPIN™ attachment system**. Unlike adhesive tapes or simple clips: * It uses a flexible brass or plastic pin with a compressed spring. * This ensures a precise, consistent pressure (force) against the electronic component. * The system includes pre-drilled holes for secure mounting to the PCB. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from corrosion and wear. #### 4. Low Profile (6mm Height) The "06F" indicates a height of only 6mm. This makes it an **Ultra-Low Profile** heat sink, ideal for: * 1U Server chassis. * Blade servers. * Small Form Factor (SFF) embedded systems. --- ### Typical Applications * **Networking:** Routers, switches, and high-speed modems. * **Computing:** Memory modules or low-wattage chipsets. * **Industrial:** Power supplies and motor controllers where vertical space is restricted.