ATS-06F-207-C2-R0
AI

The **ATS-06F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 6.39°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 25.00mm |
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### 2. Physical Design Elements
* **Fin Profile:** This model typically utilizes a **Cross-cut** or **Straight-fin** design. The "06" in the prefix usually denotes the specific fin geometry optimized for high-density airflow.
* **Base Material:** Made of high-grade aluminum for a balance between weight, cost, and thermal conductivity.
* **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance.
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### 3. Mounting System (pushPIN™)
The "F" and "R0" designations often relate to the attachment hardware. The **pushPIN™** system is characterized by:
* **Ease of Assembly:** Features a flexible mechanism that snaps into pre-drilled holes on the PCB.
* **Constant Pressure:** Uses a compression spring to ensure the heat sink maintains firm contact with the component (TIM - Thermal Interface Material).
* **Reliability:** Designed to meet industry-standard shock and vibration requirements.
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### 4. Thermal Performance
The efficiency of this part is measured by its ability to transfer heat away from the silicon die.
```python
# Example Thermal Resistance Logic (Conceptual)
def calculate_temp_rise(power_watts, thermal_resistance):
# Temp Rise = Power (W) * Thermal Resistance (C/W)
return power_watts * thermal_resistance
resistance = 6.39 # C/W at low airflow
power = 10 # Watts
temp_increase = calculate_temp_rise(power, resistance)
print(f"Component will run {temp_increase} degrees Celsius above ambient.")
```
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### 5. Common Applications
* **Telecommunications:** Cooling high-speed networking chips.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Supplies:** Managing heat in voltage regulators and MOSFETs.
- ⤷
What are the specific hole patterns required for the pushPIN mounting of the ATS-06F-207-C2-R0?
- ⤷ How does the 'C2' designation in the part number affect the thermal interface material?
- ⤷ What is the weight difference between this aluminum model and a copper equivalent?