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  • ATS-06F-207-C2-R0

  • AI
    The **ATS-06F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.39°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 25.00mm | --- ### 2. Physical Design Elements * **Fin Profile:** This model typically utilizes a **Cross-cut** or **Straight-fin** design. The "06" in the prefix usually denotes the specific fin geometry optimized for high-density airflow. * **Base Material:** Made of high-grade aluminum for a balance between weight, cost, and thermal conductivity. * **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. --- ### 3. Mounting System (pushPIN™) The "F" and "R0" designations often relate to the attachment hardware. The **pushPIN™** system is characterized by: * **Ease of Assembly:** Features a flexible mechanism that snaps into pre-drilled holes on the PCB. * **Constant Pressure:** Uses a compression spring to ensure the heat sink maintains firm contact with the component (TIM - Thermal Interface Material). * **Reliability:** Designed to meet industry-standard shock and vibration requirements. --- ### 4. Thermal Performance The efficiency of this part is measured by its ability to transfer heat away from the silicon die. ```python # Example Thermal Resistance Logic (Conceptual) def calculate_temp_rise(power_watts, thermal_resistance): # Temp Rise = Power (W) * Thermal Resistance (C/W) return power_watts * thermal_resistance resistance = 6.39 # C/W at low airflow power = 10 # Watts temp_increase = calculate_temp_rise(power, resistance) print(f"Component will run {temp_increase} degrees Celsius above ambient.") ``` --- ### 5. Common Applications * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required for the pushPIN mounting of the ATS-06F-207-C2-R0?
    • ⤷ How does the 'C2' designation in the part number affect the thermal interface material?
    • ⤷ What is the weight difference between this aluminum model and a copper equivalent?