công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-06F-203-C2-R0

  • AI
    ## Technical Overview: ATS-06F-203-C2-R0 The **ATS-06F-203-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Design** | Fine Pitch (Cross-Cut) | --- ### 2. Physical Dimensions Precision in dimensions is critical for PCB layout and component clearance. * **Length (A):** 54.00 mm * **Width (B):** 54.00 mm * **Height (C):** 10.00 mm (Low profile) * **Pitch (E):** 47.00 mm (Distance between mounting holes) * **Pitch (F):** 47.00 mm --- ### 3. Thermal Performance Data Thermal resistance measures how effectively the heat sink moves heat away from the component. Lower values indicate better cooling performance. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 8.93 | | **400 (2.0 m/s)** | 4.32 | | **600 (3.0 m/s)** | 3.23 | | **800 (4.0 m/s)** | 2.71 | --- ### 4. Core Features & Benefits * **Fine Pitch Fin Pattern:** The cross-cut fin design increases the surface area, allowing for superior heat dissipation in both natural and forced convection environments. * **Push-Pin Attachment:** This mechanical fastening system ensures a secure fit with a standardized hole pattern (47mm x 47mm), providing consistent pressure on the heat source. * **Pre-Applied TIM:** The inclusion of T766 thermal interface material simplifies the assembly process and ensures optimal thermal contact right out of the box. * **Low Profile:** With a height of only 10mm, it is ideal for space-constrained applications like 1U servers or slim embedded systems. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific advantages of T766 thermal interface material compared to standard thermal paste?
    • ⤷ Is there a specific PCB hole diameter required for the plastic push-pins used in this model?
    • ⤷ How does the 'Blue Anodized' finish affect the long-term reliability of the heat sink?