The **ATS-06F-191-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-191-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.90°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry (Straight Fin) The "191" series features a **straight-fin** design. This is optimized for systems with a clear, directional airflow (unidirectional). Straight fins offer low pressure drop, making them efficient in server racks or chassis with dedicated cooling fans. #### B. Push-Pin Attachment Mechanism This part uses a spring-loaded push-pin system. * **Reliability:** Provides consistent pressure on the component to ensure maximum heat transfer. * **Ease of Use:** Allows for quick installation without the need for specialized tools or adhesives. * **Safety:** The springs prevent over-tightening, which protects the delicate silicon die of the chip. #### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** The blue finish is not just aesthetic; it increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the electronic component. Lower values are better. * **@ 200 LFM (Linear Feet per Minute):** 2.90°C/W * **@ 500 LFM:** ~1.40°C/W * **@ 800 LFM:** ~1.00°C/W --- ### 4. Typical Applications * **Networking Gear:** Switches, routers, and high-speed modems. * **Computing:** Secondary processors or chipsets on motherboards. * **Industrial Power:** LED drivers or power modules that generate significant heat in a small footprint.