The **ATS-06F-174-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and material properties. | Specification | Value/Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | --- ### 2. Physical Dimensions | Dimension | Measurement (mm) | | :--- | :--- | | **Length (X)** | 30.00 mm | | **Width (Y)** | 30.00 mm | | **Height (Z)** | 35.00 mm | | **Pin Pitch (X)** | 35.00 mm | | **Pin Pitch (Y)** | 35.00 mm | --- ### 3. Key Electronic/Mechanical Features * **pushPIN™ Attachment:** This part utilizes a specialized spring-loaded push-pin mechanism. This ensures a consistent and secure pressure against the electronic component, which is critical for maximizing thermal transfer through the interface material. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance thermal grease) to fill microscopic air gaps between the chip and the heat sink base. * **Fin Design:** The "Fine Pitch" cross-cut pattern is optimized for forced air cooling (fan-driven airflow). The increased surface area allows for efficient heat exchange in compact electronic enclosures. * **Weight:** Being made of aluminum, it provides a high strength-to-weight ratio, ensuring it doesn't put excessive mechanical stress on the PCB (Printed Circuit Board). --- ### 4. Typical Applications This heat sink is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips and processors. 2. **Industrial PC (IPC):** Managing thermals for CPUs or FPGAs in enclosed fan-cooled environments. 3. **Power Supplies:** Heat dissipation for high-voltage MOSFETs or regulators.