The **ATS-06F-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications Below is a breakdown of the key electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Finish** | Blue Anodized | | **Dimensions** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 3.32°C/W (Unducted Flow @ 200 LFM) | | **Weight** | ~55 grams | --- ### Component Features & Functionality #### 1. Push-Pin Attachment Mechanism The "06F" and "C2" designations in the part number often refer to the specific attachment hardware. This model uses a **push-pin and spring** system: * **Ease of Assembly:** Allows for quick installation onto a PCB without the need for messy adhesives. * **Constant Pressure:** The springs ensure uniform pressure across the electronic component (like a BGA or CPU), optimizing heat transfer. #### 2. Fin Design (Cross-Cut) The unit features a **Fine-Pitch** or **Cross-Cut** fin pattern. This design is engineered to: * Increase surface area for heat dissipation. * Allow for multi-directional airflow, making it versatile for different system layouts. #### 3. Material and Coating * **AL6063 Aluminum:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also adds a layer of corrosion resistance and slightly improves emissivity. --- ### Application in Electronics This heat sink is typically used for cooling integrated circuits (ICs) that generate significant heat during operation, such as: * **FPGAs & Microprocessors:** High-speed processing units. * **Power Modules:** Voltage regulators or power converters. * **Telecommunications Gear:** Routers and switches where airflow might be restricted.