The **ATS-06F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" Series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances corrosion resistance and thermal radiation | | **Attachment Method** | pushPIN™ | Spring-loaded brass pins for secure mounting | | **Thermal Resistance** | 13.65°C/W (Unducted) | Measures efficiency at 100 LFM airflow | | **Dimensions** | 35mm x 35mm x 10mm | Low profile design for tight spaces | --- ### 2. Design Characteristics This heat sink utilizes a **Fine Pitch Straight-Fin** design. This is optimized for specific airflow conditions: * **Heat Sink Profile:** The 10mm height makes it ideal for 1U servers or compact embedded systems. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. This is a phase-change material that ensures high thermal coupling between the component and the aluminum. * **Mounting System:** The `pushPIN™` system consists of a flexible spring mechanism that provides consistent pressure, improving thermal transfer and protecting the chip from physical shock. --- ### 3. Application Use Cases This component is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but processing power generates significant heat. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). --- ### 4. Thermal Performance Table *Performance varies based on airflow (Measured in Linear Feet per Minute - LFM):* | Airflow Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 13.65 | 5.69 | 4.07 | 3.39 |