The **ATS-06F-141-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling semiconductor devices such as CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass with Plastic sleeve) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (H)** | 10.00mm | | **Fin Style** | Blue Anodized (Finish) / Straight Fin | | **Thermal Resistance** | ~15.76 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Construction The "F" in the part number indicates the fin pattern, which is optimized for specific airflow directions to maximize surface area contact with the air. * **Heat Dissipation:** The aluminum body provides high thermal conductivity to pull heat away from the electronic component. * **Push-Pin Mounting:** This model uses a spring-loaded push-pin mechanism. This ensures consistent pressure (clamping force) on the chip, which improves thermal transfer and prevents the heatsink from shifting during vibration. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease used to fill microscopic air gaps between the chip and the heatsink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact features: | Segment | Meaning | | :--- | :--- | | **ATS-06** | Product Series (pushPIN™) | | **F** | Fin Pitch / Style | | **141** | Specific Dimension Set (30x30x10mm) | | **C2** | Thermal Performance Grade / Material | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Regulating heat in routers and switches. * **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators.