The **ATS-06F-14-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 9.97°C/W (Unducted Flow @ 200 LFM) | | **Fin Pattern** | Square-Cut (Pin Fin) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps in identifying the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series/Designator for the base plate and fin height. * **F**: Fin Type (indicates a specific density/pattern). * **14**: Length/Width dimension code. * **C2**: Thermal Interface Material (TIM). "C2" typically denotes **T766** high-performance thermal grease pre-applied to the base. * **R0**: RoHS Compliance version. --- ### 3. Key Electronic Cooling Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the square-cut pin fin design allows for **multi-directional airflow**. This is critical in electronics where the fan might not be perfectly aligned with the fins, or where air turbulence is needed to break down the thermal boundary layer. #### B. Push-Pin Attachment The component uses a brass push-pin mechanism with a compression spring. This provides: 1. **Consistent Pressure**: Ensures the thermal interface material (TIM) is compressed evenly against the chip. 2. **Mechanical Stability**: Reduces the risk of the heat sink shifting during vibration or transport. #### C. Thermal Interface Material (TIM) The "C2" designation means it comes with a pre-applied phase-change material or high-conductivity grease. This eliminates the need for manual application, reducing assembly time and ensuring a thin, even layer for optimal heat transfer from the silicon to the aluminum. --- ### 4. Ideal Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and high-speed modems. * **Power Electronics:** Voltage regulators and high-density power modules.