The **ATS-06F-124-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications The model number encodes specific data about the thermal performance and physical dimensions: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 50mm x 50mm x 25mm | | **Fin Type** | XC-CUT (Cross-cut) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~3.25 °C/W (at 200 LFM) | | **Pressure Spring** | Brass Spring | --- ### 2. Physical Design Features #### XC-CUT Fin Geometry The "XC-CUT" design refers to a straight-fin heat sink that has been cross-cut to create a grid of square or rectangular pins. * **Omnidirectional Airflow:** Unlike straight fins that require air to flow along the channel, the cross-cut design allows air to enter from any direction, making it ideal for enclosures with unpredictable airflow. * **Surface Area:** This design maximizes the surface area exposed to the air without significantly increasing the footprint. #### Attachment Mechanism (Push-Pin) This part uses a **Plastic Push-Pin** with a **Brass Spring**. * **Reliability:** The spring provides a consistent "clamping force" (pressure) between the heat sink and the component, ensuring the Thermal Interface Material (TIM) works efficiently. * **Installation:** It requires pre-drilled holes in the PCB. --- ### 3. Thermal Performance Profile Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.25 | | **300 (1.5 m/s)** | 2.32 | | **500 (2.5 m/s)** | 1.65 | --- ### 4. Component Application * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied (a high-performance phase-change material) or a similar thermal pad. * **Use Cases:** It is commonly used for cooling FPGAs, ASICs, and high-wattage power converters where natural convection is insufficient and forced-air (fans) is present.