## Electronic Component Analysis: ATS-06F-113-C2-R0 The **ATS-06F-113-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed specifically for thermal management of electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-113-C2-R0 | | **Heat Sink Type** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring loaded) | | **Thermal Resistance** | 1.17 °C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm x 10mm | --- ### 2. Physical Design and Construction This part is engineered to maximize surface area for heat dissipation while maintaining a low profile. * **Material:** Made of high-grade aluminum for high thermal conductivity and low weight. * **Fin Style:** Features a "Fine-Pitch" design (straight fins), which is optimized for systems with higher airflow. * **Finish:** The blue anodized coating not only provides an aesthetic look but also offers corrosion resistance and improves emissivity. --- ### 3. Mounting Mechanism (pushPIN™) The "pushPIN™" system is a key feature of this component. It is designed to provide a secure and vibration-resistant attachment to the Printed Circuit Board (PCB). * **Hardware:** Includes a brass or plastic push pin and a high-performance compression spring. * **Uniform Pressure:** The spring ensures consistent pressure is applied across the thermal interface material (TIM) for optimal heat transfer. * **Ease of Install:** Designed for quick assembly with pre-drilled holes in the PCB. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.17 | | 200 (1.0 m/s) | 1.05 | | 300 (1.5 m/s) | 0.95 | | 400 (2.0 m/s) | 0.88 | --- ### 5. Common Applications * **Consumer Electronics:** High-end routers and modems. * **Industrial PC:** Small form factor industrial controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Telecommunications:** Cooling of high-speed processing chips.