The **ATS-06F-08-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for electronic components that require efficient thermal management, such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance (Unducted)** | 14.61 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.33 °C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Pitch** | Fine Pitch | --- ### 2. Key Components & Features * **Heat Sink Material:** Constructed from high-grade aluminum to balance weight and thermal conductivity. * **Push-Pin Attachment:** Features a spring-loaded mechanism that ensures consistent pressure on the component (e.g., a chip), improving heat transfer through the thermal interface material (TIM). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** high-performance thermal grease or a similar phase-change material. * **Fine Pitch Fin Design:** The "F" in the part number indicates a fine-pitch fin structure, which maximizes surface area for heat dissipation in environments with higher airflow. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: | Segment | Code | Meaning | | :--- | :--- | :--- | | **Series** | ATS-06 | Part of the pushPIN™ Series | | **Fin Type** | F | Fine Pitch Fin geometry | | **Dimensions** | 08 | Specific footprint/height profile | | **Material/Finish** | C2 | Blue Anodized Finish | | **Compliance** | R0 | RoHS-6 Compliant | --- ### 4. Application Use Cases This heat sink is commonly used in: 1. **Networking Hardware:** Cooling ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.