The **ATS-06F-07-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.09 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Design Features ### Thermal Efficiency The "07" in the part number denotes the specific fin pattern and height. This model uses a **fine-pitch fin design** which increases the surface area for heat dissipation, making it ideal for high-density PCB layouts where airflow may be restricted. ### Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the pushPIN™ system uses: * **Compression Springs:** Provides precise pressure to ensure optimal contact with the component. * **Plastic/Brass Push Pins:** Securely locks the heat sink into pre-drilled holes on the PCB. * **Reliability:** Highly resistant to shock and vibration compared to "peel-and-stick" solutions. ### Material & Coating * **Aluminum Construction:** Offers a balance between lightweight design and thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling. --- ## 3. Applications This heat sink is typically found in: * **Network Switches/Routers:** Cooling processors that handle high data throughput. * **Industrial Power Supplies:** Managing heat in voltage regulators. * **Embedded Systems:** Protecting SoCs (System on Chips) in compact enclosures. ---