The **ATS-06F-06-C3-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" heat sink series designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 20.27 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management Efficiency The primary role of this part is to dissipate heat generated by active electronic components like CPUs, GPUs, or FPGAs. It features a **Straight Fin** design which provides a large surface area for heat exchange, optimized for environments with forced air cooling (fans). #### 2. Push-Pin Attachment System Unlike adhesive-based heat sinks, the "06F" series uses a mechanical push-pin system: * **Stability:** Provides consistent pressure on the component to improve thermal interface material (TIM) performance. * **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal cycling. * **Pre-drilled Holes:** Requires the PCB to have specific hole patterns (20mm or 32mm spacing depending on the specific sub-model). #### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Beyond aesthetics, the anodized coating increases emissivity and provides a layer of electrical insulation and corrosion resistance. #### 4. Thermal Interface Material (TIM) The "C3" designation often implies that the part comes pre-applied with a high-performance thermal phase-change material or grease, ensuring minimal air gaps between the heat source and the aluminum base. --- ### Comparison of Airflow Performance | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 20.27 | | 200 | 9.03 | | 400 | 5.38 | | 600 | 4.23 | ---