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  • ATS-06F-05-C2-R0

  • AI
    The **ATS-06F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Type** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~11.0°C/W (at 100 LFM) | --- ### 2. Design and Component Breakdown #### A. The Fin Profile (Cross-Cut) This model features a **cross-cut** fin pattern. Unlike straight fins, cross-cutting breaks up the airflow, creating turbulence. This increases the surface area contact with the air and significantly improves cooling efficiency in low-to-medium airflow environments. #### B. The pushPIN™ Attachment System The part uses a specialized attachment mechanism consisting of: * **Plastic Pins:** Flexible pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the electronic component to ensure optimal thermal contact. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-05** thermal interface material. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink base and the chip to maximize heat transfer. --- ### 3. Part Number Decoder The part number can be broken down to understand the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **06** | Series Identification | | **F** | Fin style/Pitch | | **05** | Mounting Hole Pattern Code | | **C2** | Thermal Interface Material (TIM) type | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications This part is commonly used in electronic systems where space is limited but heat dissipation is critical, such as: * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Consumer Electronics:** High-end audio/video processing units.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ How does the thermal resistance change as airflow (LFM) increases for this model?
    • ⤷ Can the pushPIN attachment be replaced with adhesive tape?