ATS-06F-05-C2-R0
AI

The **ATS-06F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling integrated circuits (ICs) and other PCB-mounted components.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Type** | pushPIN™ (Spring-loaded plastic pins) |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 25mm |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | ~11.0°C/W (at 100 LFM) |
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### 2. Design and Component Breakdown
#### A. The Fin Profile (Cross-Cut)
This model features a **cross-cut** fin pattern. Unlike straight fins, cross-cutting breaks up the airflow, creating turbulence. This increases the surface area contact with the air and significantly improves cooling efficiency in low-to-medium airflow environments.
#### B. The pushPIN™ Attachment System
The part uses a specialized attachment mechanism consisting of:
* **Plastic Pins:** Flexible pins that snap into pre-drilled holes on the PCB.
* **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the electronic component to ensure optimal thermal contact.
#### C. Thermal Interface Material (TIM)
The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-05** thermal interface material. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink base and the chip to maximize heat transfer.
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### 3. Part Number Decoder
The part number can be broken down to understand the specific configuration:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **06** | Series Identification |
| **F** | Fin style/Pitch |
| **05** | Mounting Hole Pattern Code |
| **C2** | Thermal Interface Material (TIM) type |
| **R0** | RoHS Compliant / Revision code |
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### 4. Applications
This part is commonly used in electronic systems where space is limited but heat dissipation is critical, such as:
* **Networking Gear:** Switches and Routers.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
* **Consumer Electronics:** High-end audio/video processing units.
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ How does the thermal resistance change as airflow (LFM) increases for this model?
- ⤷ Can the pushPIN attachment be replaced with adhesive tape?