## Technical Overview of ATS-06D-87-C2-R0 The **ATS-06D-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 20.00mm | --- ### 2. Design and Component Breakdown #### A. The Fin Profile The "87" in the part number refers to a specific fin configuration. This model typically features a **Straight Fin** or **Cross-Cut** design. * **Purpose:** To maximize surface area contact with the air. * **Performance:** Optimized for forced air cooling (fans) but capable of natural convection. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the ATS-06D-87-C2-R0 uses a mechanical attachment system: * **Push-Pins:** These provide consistent pressure across the interface between the chip and the heat sink. * **Springs:** Specifically calibrated springs ensure the correct "compression force" is applied to the component, preventing damage while ensuring maximum heat transfer. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; anodizing improves the emissivity of the surface, slightly enhancing radiant heat transfer and providing corrosion resistance. --- ### 3. Thermal Performance Metrics The efficiency of this part is measured by its thermal resistance (expressed in °C/W). Lower values indicate better cooling. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.16 | | 200 (1.0 m/s) | 4.42 | | 400 (2.0 m/s) | 2.72 | | 600 (3.0 m/s) | 2.02 | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Industrial PCs:** Cooling processors in compact enclosures where airflow is managed.