The **ATS-06D-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Fin Depth)** | 20.00 mm | | **Fin Pitch** | Fine-Pitch | | **Fin Style** | Straight (Cross-Cut) | | **Thermal Resistance** | ~6.67°C/W (at 1.0 m/s airflow) | --- ## 2. Key Components & Features ### A. pushPIN™ Attachment System This part uses a specialized mounting mechanism designed for secure and easy installation. * **Springs:** Provides consistent pressure (Pre-assembled) to ensure optimal thermal interface contact. * **Plastic/Brass Pins:** Locks the heat sink into pre-drilled holes on the PCB. ### B. Material and Thermal Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not only provides aesthetic value but also increases corrosion resistance and emissivity (radiative heat transfer). ### C. Fin Geometry * The **Straight-Fin** design is optimized for environments with forced convection (fan-cooled systems). * The cross-cut pattern allows for better airflow management and increased surface area compared to basic extruded blocks. --- ## 3. Applications The ATS-06D-71-C2-R0 is typically found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. --- ## 4. Thermal Performance Comparison (Airflow) Thermal resistance ($\theta$) decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.67 | | 400 | 2.0 | 2.51 | | 600 | 3.0 | 1.74 |