The **ATS-06D-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 1.41 °C/W @ 200 LFM | | **Dimension (L x W)** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Attachment Method** | pushPIN™ (Brass/Plastic) | | **Pressure Spring** | ATS-PP-04 | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part number follows a specific nomenclature used by ATS to describe its functional properties: * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design. This maximizes the surface area for radiant cooling while minimizing pressure drop as air passes through. * **pushPIN™ Attachment:** This model uses a mechanical fastening system (push-pins and springs) rather than adhesive tape. This provides consistent pressure (interface force) between the component and the heat sink, ensuring better thermal conductivity. * **C2 Material/Finish:** The "C2" suffix typically denotes the use of a Blue Anodized finish, which provides corrosion resistance and slightly improves thermal emissivity. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a phase-change material or high-performance grease that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This specific model is ideal for medium-to-high density electronic packaging where airflow is directed across the board: 1. **Telecommunications:** Cooling of high-speed ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 1.41 | | 400 | 2.0 | 0.86 | | 600 | 3.0 | 0.70 |