The **ATS-06D-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | Uses a push-pin attachment mechanism | | **Base Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases corrosion resistance and emissivity | | **Fin Type** | Fine Pitch | Maximizes surface area for heat dissipation | | **Attachment Type** | Push-Pin | Secure mounting using spring-loaded pins | | **Thermal Resistance** | 15.31 °C/W (Unducted) | Performance at 100 LFM (Linear Feet per Minute) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring the heat sink does not interfere with neighboring components. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 15.00 mm | | **Hole Spacing (E)** | 50.00 mm | | **Hole Spacing (F)** | 50.00 mm | --- ### 3. Electronic Application & Features The ATS-06D-68-C2-R0 is engineered for modern electronic assemblies with the following features: * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material, which fills microscopic air gaps between the heat sink and the component to improve heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin design ensures a consistent, high-pressure contact between the heat sink and the component, which is vital for long-term reliability. * **Airflow Optimization:** The "Cross-Cut" or "Straight Fin" design (depending on the specific revision within the 68-C series) is optimized for forced-air cooling environments (fans). --- ### 4. Typical Use Cases * **Voltage Regulator Modules (VRMs):** Managing heat in power conversion circuits. * **Application Specific Integrated Circuits (ASICs):** Cooling custom chips in networking gear. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.