The **ATS-06D-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 20.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Pitch** | Fine Pitch | --- ### 2. Physical Design Details The part utilizes a specific design language meant for high-density electronic assemblies: * **Straight Fin Profile:** The "straight fin" design is optimized for high-performance airflow environments. It provides a large surface area for heat exchange relative to its low height. * **pushPIN™ Attachment:** This system features a pre-assembled brass or plastic pin and a compression spring. It is designed to provide the exact amount of pressure required for optimal thermal interface material (TIM) performance without damaging the PCB. * **Low Profile:** With a height of only **10.00mm**, this heat sink is ideal for "1U" server racks or low-clearance consumer electronics. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the component. Lower values are better at higher airflows (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 20.30 | | 300 | 1.5 | 6.67 | | 500 | 2.5 | 4.07 | | 700 | 3.5 | 3.10 | --- ### 4. Key Component Materials * **Body:** High-grade aluminum for lightweight and efficient thermal conductivity. * **Finish:** Blue Anodized, which provides corrosion resistance and a slight improvement in emissivity. * **Springs:** Specialized springs provide precise tension to ensure a "firm" seat on the chip, preventing air gaps.