The **ATS-06D-65-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These components are critical in electronics to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine-Pitch, Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Finish** | Blue Anodized (RoHS Compliant) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body (Aluminum) The core of the part is a 45mm x 45mm aluminum block. Aluminum is chosen for its high thermal conductivity and lightweight properties. The **C2** in the part number refers to the specific blue anodized finish, which provides surface protection and slightly increases emissivity. #### 2. Fin Design (Fine-Pitch) The "65" in the part number designates a specific fin pattern. This model uses a **fine-pitch fin design**, which maximizes the surface area within a small footprint. This is essential for electronic boards with high component density where airflow might be obstructed. #### 3. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses **brass push-pins with steel springs**. * **Mechanical Benefit:** Provides consistent pressure (preload) against the electronic chip. * **Reliability:** Ensures the thermal interface material (TIM) remains in contact even during vibration or thermal expansion. #### 4. Thermal Interface Material (TIM) The "R0" indicates that the part comes with **pre-applied thermal interface material**. This is a phase-change material or thermal grease located on the bottom of the sink that fills microscopic air gaps between the heatsink and the electronic component, ensuring efficient heat transfer. --- ### Thermal Performance Overview Performance is measured by how effectively the part lowers the temperature per watt of power generated. * **Low Airflow (100 LFM):** 7.29 °C/W * **High Airflow (500 LFM):** 1.47 °C/W *Note: As airflow increases, the thermal resistance drops significantly, making it ideal for fan-cooled enclosures.* ---