The **ATS-06D-23-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and physical parameters for this component: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-06D-23-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 12.01°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 60mm x 60mm x 15mm | | **Pressure Spring** | Stainless Steel (Blue Anodized) | | **Interface Material** | T766 (Phase Change Material) | --- ### 2. Electronic/Thermal Performance The performance of this part is measured by its ability to lower the operating temperature of a semiconductor. Its efficiency is highly dependent on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 12.01°C/W * **High Airflow (700 LFM):** 1.80°C/W **Electronic Context:** If your electronic chip generates **10 Watts** of heat and the airflow is 400 LFM (3.11°C/W), the temperature of the chip will rise **31.1°C** above the ambient temperature. --- ### 3. Key Electronic Components & Features #### A. The Fin Design (maxiFLOW™) The "spread fin" geometry is engineered to maximize surface area. In electronics, this reduces the thermal bottleneck between the silicon die and the surrounding air, preventing **Thermal Throttling** or component failure. #### B. pushPIN™ Attachment System Unlike adhesive tapes which can act as insulators, the `pushPIN™` system uses a precise spring-loaded mechanism. This ensures: * **Constant Pressure:** Optimizes the contact between the heat sink and the electronic chip. * **Reliability:** Resistant to vibrations that occur in industrial or server environments. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is critical because it fills microscopic air gaps between the chip and the heat sink, significantly increasing thermal conductivity. --- ### 4. Typical Applications * **Voltage Regulator Modules (VRMs):** Managing heat in power conversion. * **Embedded Systems:** Cooling processors in tight enclosures. * **Telecommunications:** Cooling high-speed data transmission chips.