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The **ATS-06D-166-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Family** | pushPIN™ Heat Sink Assembly |
| **Material** | Aluminum (Body), Blue Anodized (Finish) |
| **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring (STS-01) |
| **Interface Material** | T412 (Thermal Tape/Grease equivalent) |
| **Dimensions** | 25mm x 25mm x 15mm |
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### Key Electronic & Mechanical Components
#### 1. The Heat Sink Body
Constructed from lightweight aluminum, this part uses a **Straight Fin** design. In electronics, the fins increase the surface area available to transfer heat from the semiconductor die to the surrounding ambient air. The "Blue Anodized" finish is not just aesthetic; it provides corrosion resistance and slightly improves emissivity.
#### 2. Push-Pin Attachment Mechanism
Instead of using adhesive or solder, this part uses a mechanical push-pin system.
* **Brass Push-Pins:** These provide a secure, vibration-resistant attachment to the PCB (Printed Circuit Board).
* **Compression Springs:** These ensure "Precise Engagement Force." This is critical in electronics because it maintains consistent pressure between the chip and the heatsink for optimal heat transfer without cracking the delicate silicon die.
#### 3. Thermal Interface Material (TIM)
The part comes pre-applied with **T412**, a high-performance thermal interface. Its job is to fill the microscopic air gaps between the electronic component and the heatsink base, significantly reducing thermal impedance.
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### Performance under Airflow
As airflow (LFM - Linear Feet per Minute) increases, the cooling efficiency improves:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 12.30 |
| 300 (1.5 m/s) | 5.33 |
| 500 (2.5 m/s) | 4.02 |
| 700 (3.5 m/s) | 3.40 |
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How do I calculate if this heatsink is sufficient for my chip's TDP?
- ⤷ What is the specific PCB hole pattern required for the push-pin installation?
- ⤷ How does 'T412' thermal material compare to standard thermal paste?