The **ATS-06D-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). ### 1. Technical Specifications Below are the key physical and thermal parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 30mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.93°C/W (at 100 LFM) | | **Flow Orientation** | Straight Fin | | **Weight** | 53.00 grams | --- ### 2. Component Design & Features The "electronic parts" of this assembly consist of the thermal dissipater and the mechanical mounting hardware: * **Straight Fin Design:** The fins are aligned in a straight pattern to allow for maximum airflow through the sink, making it ideal for high-speed air-cooled environments. * **pushPIN™ Mounting:** Instead of using adhesive tape which can fail under high heat, this part uses a mechanical push-pin system. This ensures consistent pressure between the heat sink and the component (CPU/GPU/FPGA), improving thermal transfer. * **Compression Spring:** Includes a high-performance spring that provides the necessary force to maintain a tight "bond" with the thermal interface material (TIM). * **Material Science:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides corrosion resistance and improves emissivity. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Series (pushPIN™) | | **D** | Material/Process Variation | | **151** | Model Dimension Identifier | | **C2** | Thermal Performance Grade / Finish | | **R0** | RoHS Compliant Version | --- ### 4. Application Use-Cases This heat sink is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where mechanical stability is required due to vibration.