The **ATS-06D-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.84°C/W (at 200 LFM) | | **Flow** | High Flow / Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The body is constructed from aluminum for high thermal conductivity. It utilizes a **straight-fin design**, which is optimized for systems with forced-air cooling (fans). The 25mm height allows for a significant surface area to dissipate heat from high-performance ICs, CPUs, or GPUs. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "06D" series uses the proprietary **pushPIN™** system. This consists of: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** Provides consistent, high-pressure contact between the heat sink and the component, ensuring maximum heat transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ### 3. Part Number Decoder Understanding the "ATS-06D-100-C2-R0" nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series identifier. * **D:** Specific hole pattern/attachment style. * **100:** Package/Size identifier. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision code. --- ### 4. Application Use Cases This component is typically used in: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** Industrial PCs where vibration resistance is needed (provided by the pushPIN). 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.