The **ATS-06D-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push Pin" series, specifically designed for cooling high-density electronic components like CPUs, GPUs, and high-speed FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | | **Mounting Type** | Push Pin (Plastic) | | **Attachment Hole Pattern** | 2-Hole | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 21.90° C/W (at 100 LFM) | | **Fin Style** | Straight Fin (Cut) | --- ### 2. Key Components & Engineering The part is comprised of several distinct "electronic packaging" elements that work together to manage heat: * **The Heat Sink Body:** Made of extruded aluminum, featuring high fin density to increase the surface area available for convective cooling. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or similar, which fills microscopic air gaps between the component and the heat sink. * **Push Pin Mechanism:** This consists of a plastic (usually brass-tipped or nylon) pin and a compression spring. This ensures a constant, uniform pressure (clamping force) on the semiconductor, which is critical for efficient thermal transfer. --- ### 3. Thermal Performance Profile Thermal resistance varies significantly based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 21.90 | | 200 (Low flow) | 9.60 | | 400 (Moderate flow) | 6.00 | | 600 (High flow) | 4.40 | --- ### 4. Applications This part is commonly used in industrial and telecommunications electronics where space is limited but heat dissipation requirements are high: * **Network Switches/Routers:** Cooling processing chips. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** For industrial PCs (IPCs) requiring passive or forced-air cooling.