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  • ATS-06B-41-C2-R0

  • AI
    The **ATS-06B-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 10.03°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Pattern** | Square (Grid) | | **Compression Spring** | Stainless Steel | --- ### 2. Design and Component Parts This part is more than just a piece of metal; it is an assembly designed for secure attachment and optimal heat dissipation. * **Heat Sink Body:** Constructed from high-quality aluminum for thermal conductivity. The 25mm height and square fin design maximize the surface area for convective cooling. * **Push Pin Mechanism:** Uses brass push pins that snap into pre-drilled holes on the PCB. This provides consistent pressure for thermal interface material (TIM) performance. * **Compression Springs:** These are located on the pins to ensure the heat sink maintains a constant force against the electronic chip, preventing gaps during vibration or thermal expansion. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal tape or pad (check specific lot details) to bridge the air gap between the component and the heat sink. --- ### 3. Application Use Cases This component is generally used in the following electronic environments: 1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for high-power transistors or voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-06B-41-C2-R0 depends heavily on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.35 | | 200 (1.0 m/s) | 10.03 | | 400 (2.0 m/s) | 6.51 | | 600 (3.0 m/s) | 5.02 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the brass push pins?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied TIM?
    • ⤷ What are the advantages of blue anodized finishes in electronics?