ATS-06B-41-C2-R0
AI

The **ATS-06B-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount components.
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### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Thermal Resistance** | 10.03°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Fin Pattern** | Square (Grid) |
| **Compression Spring** | Stainless Steel |
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### 2. Design and Component Parts
This part is more than just a piece of metal; it is an assembly designed for secure attachment and optimal heat dissipation.
* **Heat Sink Body:** Constructed from high-quality aluminum for thermal conductivity. The 25mm height and square fin design maximize the surface area for convective cooling.
* **Push Pin Mechanism:** Uses brass push pins that snap into pre-drilled holes on the PCB. This provides consistent pressure for thermal interface material (TIM) performance.
* **Compression Springs:** These are located on the pins to ensure the heat sink maintains a constant force against the electronic chip, preventing gaps during vibration or thermal expansion.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal tape or pad (check specific lot details) to bridge the air gap between the component and the heat sink.
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### 3. Application Use Cases
This component is generally used in the following electronic environments:
1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches.
2. **Industrial PCs:** Thermal management for embedded processors.
3. **Power Supplies:** Heat dissipation for high-power transistors or voltage regulators.
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### 4. Thermal Performance Comparison
The effectiveness of the ATS-06B-41-C2-R0 depends heavily on the Air Velocity (LFM - Linear Feet per Minute):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 17.35 |
| 200 (1.0 m/s) | 10.03 |
| 400 (2.0 m/s) | 6.51 |
| 600 (3.0 m/s) | 5.02 |
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What are the PCB hole requirements for mounting the brass push pins?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied TIM?
- ⤷ What are the advantages of blue anodized finishes in electronics?