The **ATS-06B-38-C2-R0** is a specific high-performance electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** family, designed to provide efficient heat dissipation for high-power electronic components. --- ## 1. Technical Specifications The part is primarily a heat sink designed for high-density electronic assemblies. Below are the key physical and thermal specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 36.83mm x 46.45mm | | **Height** | 22.86mm | | **Thermal Resistance** | 0.84 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (with Brass Springs) | | **Interface Material** | T766 (Thermal Interface Material) | --- ## 2. Key Design Elements ### A. maxiFLOW™ Geometry The "B" in the part number refers to the **maxiFLOW™** fin pattern. Unlike standard square fin heat sinks, this design features a spread-fin profile. This reduces pressure drop and increases the surface area exposed to airflow, making it highly effective in environments with constrained air movement. ### B. pushPIN™ Attachment System The **-R0** suffix indicates the inclusion of the pushPIN™ mounting system. * **Ease of Install:** Allows for quick, tool-free installation onto the PCB. * **Constant Pressure:** Uses a compression spring (Brass) to ensure a precise, firm contact between the heat sink and the component, maximizing thermal conductivity. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the heat sink and the electronic chip (CPU, GPU, or FPGA), significantly lowering thermal resistance. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Series/Style | | **B** | Fin Geometry (maxiFLOW™) | | **38** | Body Size Indicator | | **C2** | Color/Finish (Black Anodized) | | **R0** | Revision/Kit (Includes pushPIN™ hardware) | --- ## 4. Application Use Cases This part is typically found in: * **Telecommunications:** Cooling of high-speed network switches and routers. * **Data Centers:** High-performance server processors. * **Embedded Systems:** Industrial PCs where space is limited but heat output is high.